Making More Possible
For information about the 3DSoC Early Access Program complete the form at the bottom of this page.
In 2018, SkyWater began charting a new course for the industry through work to establish the world’s first carbon nanotube-based microelectronics architecture available with a PDK enabled design flow at a commercial foundry. This work is made possible through collaboration with MIT and the $61M 3DSoC program funded by DARPA, the largest awarded program in the first round of the Electronics Resurgence Initiative (ERI).
About the 3DSoC Architecture
Conventional computing architectures consist of separate chips for processing/computing and memory. These chips are connected through physical interconnects which limit system performance. Through monolithic fabrication, 3DSoC will transform this system into a single integrated stack with multiple layers of computing built directly on top of one another, interleaved with layers of memory. The result is up to 50x SoC performance benefits at power using 90 nm 3D technology compared 7 nm 2D technology. (Source: DARPA. Microsystems Technology Office Broad Agency Announcement. No. HR001117S0056. Sept 2017.)
For more information about how this innovative technology is enabling the next wave of computing, check out the following resources:
2019 DARPA ERI Summit: Three Dimensional Monolithic System-on-a-Chip (3DSoC).
3DSoC Articles in Nature
SkyWater Press Releases
3DSoC Early Access Program
SkyWater will be selecting a limited number of organizations to take part in an early access partner program for the 3DSoC process technology. Request your spot today!
1. Receive exclusive pre-market communications and program updates
2. Represent your technology needs and contribute to definition of design and platform IP requirements
3. Participate in design engagement planning