Design Partner Network

FRONTGRADE has been a strategic Application Specific Integrated Circuit (ASIC) design and manufacturing partner to the Aerospace and Defense community since the early 1980’s. We have successfully executed hundreds of Application Specific Integrated Circuit (ASIC) designs for domestic and international customers with the technical experience and expertise to offer a range of engagement models for advanced digital, power, analog, and mixed-signal products. Typical engagement models include full turnkey or front-end / back-end collaborative design services.

IC Enable is an award-winning provider of quality Design IP, IC Products, Services and Platform Solutions. Since 2004, IC Enable has had a history of success in delivering to Fortune 50 customers. The team has extensive experience across the Defense, Medical, Semiconductor, and Consumer Electronics industries, including some of the most challenging fabrication processes and product applications in the world. Committed to developing and retaining high-performing staff, IC Enable provides businesses with the expertise to complete complex design projects.

Senseeker is an industry leader in the development of advanced digital readout integrated circuits for infrared imaging systems. Senseeker’s products can be used with industry standard and specialist infrared detector types, and are in use in many commercial and U.S. Government applications. Senseeker also offers custom mixed-signal transducer IC design services and support for IC design work with test electronics hardware and software.

SenseICs Corporation is engineering innovation in microelectronics technology by developing cutting-edge integrated circuits (IC) ranging from analog and mixed-signal to systems-on-a-chip (SoC). SenseICs specializes in providing full turnkey IC development solutions including design, fabrication, packaging, automated qualification test systems, and application support. Our areas of expertise cover advanced imaging sensors, RF communication systems and components, trusted microelectronics in advanced nodes, and radiation hardening by design. Partnering with SkyWater, our capabilities synergize to deliver the most comprehensive, turnkey, and verified IP solutions available in the current market.

Trusted Semiconductor Solutions leverages the best commercial technology and manufacturing capabilities to create high-reliability integrated circuits for use in military/defense, space, avionics and industrial applications. As a SkyWater partner, these capabilities complement our offerings to bring you the most complete, trusted solutions in the market today.

IP Collaborators

Intelligent system design to accelerate design of the most complex electronics and intelligent systems. SkyWater’s PDK environment is based on a Cadence tool set which ensures:

  • Silicon design excellence
  • System innovation
  • Pervasive intelligence offers a crowd platform and marketplace for chip design that uses open source and community models to make the design and commercialization of ICs simple, inexpensive and accessible to everyone. Product developers use this platform to rapidly, cost-effectively and reliably create custom silicon. Chip developers use the solution to dramatically reduce cost and time to market for proof of concept of new and exciting ICs. The Efabless model is extensible to advanced packaging, software, subsystems and full systems.

Recently, Efabless and SkyWater launched the chipIgnite Program which includes a pre-designed carrier chip and automated open source design flow from Efabless and SkyWater’s open source SKY130 process.

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Frontgrade pioneers the future and underpins many of the world’s most critical missions. Our rad-hard microelectronics empower the world’s leading spacecraft: from leading high throughput commercial communications satellites, earth observation satellites, and manned space, to high priority national security missions, deep space exploration to Mars and beyond, and the latest new space constellations. Our RF transmission and antenna solutions enable space signal transmission, search & surveillance, satellite communications, missile defense radars, missile seekers, electronic warfare systems that keep warfighters safe, and civil aviation radars that ensure the safety of the flying public. Our highly complex motion control products enable satellite solar panel actuation, Mars Rover actuation, and optical steering. Our power management solutions convert and distribute power in the harshest of environments. In addition, our high reliability microelectronics enable genome sequencers and CT scanners that health care professionals use to improve people’s health.

QuickLogic Corporation (NASDAQ: QUIK) is a publicly traded, US-owned, trusted supplier of FPGA and eFPGA cores with a proven 30+ year track record in delivering millions of units for commercial, ruggedized and mission critical applications. Five of the Top five and eight of the Top 10 DOD Primes use our technology today. Our Australis eFPGA IP generator leverages foundry standard cell libraries, enabling us to go from concept to tapeout of a customized FPGA/eFPGA for any process node in as little as days. In addition to our proprietary Aurora FPGA User Tools, we are also the first FPGA vendor that has shipped products with 100% open-source FPGA user tools, supporting RTL-to-bitstream for fully transparent and inspectable FPGA user tools. QuickLogic is a member of the DARPA Toolbox Initiative.

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Siemens EDA (part of Siemens Digital Industries Software) is a technology leader in electronic design automation, providing products, consulting services, and award-winning support for the world’s most successful electronics and semiconductor companies.  We offer the broadest industry portfolio of best-in-class hardware and software design solutions focused on IC design and physical verification, functional verification, design for test, PCB design, embedded software, thermal and fluid analysis, and integrated system design. Siemens EDA tools provide innovative, scalable solutions for a wide range of design challenges in markets, including automotive, consumer, communications, computer, industrial and military-aerospace, and IoT.

Trusted Semiconductor Solutions leverages the best commercial technology and manufacturing capabilities to create high-reliability integrated circuits for use in military/defense, space, avionics and industrial applications. As a SkyWater partner, these ca complement our offerings to bring you the most complete, trusted solutions in the market today.

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Weebit Nano Ltd. is a leading developer of next-generation semiconductor memory technology. The company’s ground-breaking Resistive RAM addresses the growing need for significantly higher performance and lower power memory solutions in a range of new electronic products such as Internet of Things devices, smartphones, robotics, autonomous vehicles, 5G communications and artificial intelligence. Weebit’s ReRAM allows semiconductor memory elements to be significantly faster, less expensive, more reliable and more energy efficient than those using existing Flash memory solutions. Because it is based on fab-friendly materials, the technology can be quickly and easily integrated with existing flows and processes, without the need for special equipment or large investments.

SkyWater licenses Weebit’s ReRAM technology for a range of customer designs to enable higher performance and lower power memory solutions in IoT, automotive, AI and other applications.

Check out the IP from Weebit Nano

Process Technology Collaborators

BRIDG is a non-for-profit entity and key partner for administering performance on USG-funded technology programs at the SkyWater Florida site (also known as the Center for Neovation). BRIDG provides an engagement channel at SkyWater’s Florida site for organizations that wish to interface with a nonprofit entity on advanced packaging technology programs. BRIDG is also focused on organizing an advanced packing National Manufacturing Institute that will be based out of the Center for Neovation to advance domestic development and low-volume prototyping of various back-end and advanced packaging technologies.

Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, Deca’s 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies in the first generation of M-Series fan-out and Adaptive Patterning®. As the industry moves to chiplets and heterogeneous integration, Deca’s Gen 2 technologies provide licensees with a powerful platform for future products. Deca’s vision is to empower customer innovation with advanced electronic interconnect technologies.

Recently, SkyWater signed a technology transfer and license agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology which enables state-of-the-art onshore advanced packaging foundry services.

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The MIT community is driven by a shared purpose: to make a better world through education, research and innovation. We are fun and quirky, elite but not elitist, inventive and artistic, obsessed with numbers, and welcoming to talented people regardless of where they come from. Through teaching, research, and innovation, MIT’s exceptional community pursues its mission of service to the nation and the world.

SkyWater works with MIT on next-generation technology development for DARPA Electronics Resurgence initiative

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External Packaging Partners

Integra Technologies is a global leader in the sourcing, packaging, testing, and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle – from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high reliability applications.

  • Packaged Die test program development
  • Wafer grinding, dicing, and package test of die
  • Reliability qualification of packaged die
  • Thermal stress testing of packaged die
  • Wafer sort program development
  • Volume wafer sorting

Micross AIT offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight and power, or SWaP. Micross AIT houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems which include:

  • 3D integration technology: TSV, TGV, Si interposers, 3D IC
  • Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps, IIC Quilt Packaging interconnect fabrication
  • Flip-chip & multi-chip module assembly, including patented PADS fluxless assembly process
  • Novel microfabricated devices, including IR sensor and thin film thermoelectric solutions
  • Microstructure fabrication and packaging: Monolithic integration, vacuum microelectronics, wafer-level vacuum/hermetic packaging
  • Microfabrication facility offering development, custom (flexible) prototyping & small-volume production services for our customers

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