Intelligent system design to accelerate design of the most complex electronics and intelligent systems. SkyWater’s PDK environment is based on a Cadence tool set which ensures:
Efabless.com offers a crowd platform and marketplace for chip design that uses open source and community models to make the design and commercialization of ICs simple, inexpensive and accessible to everyone. Product developers use this platform to rapidly, cost-effectively and reliably create custom silicon. Chip developers use the solution to dramatically reduce cost and time to market for proof of concept of new and exciting ICs. The Efabless model is extensible to advanced packaging, software, subsystems and full systems.
Recently, Efabless and SkyWater launched the chipIgnite Program which includes a pre-designed carrier chip and automated open source design flow from Efabless and SkyWater’s open source SKY130 process.
QuickLogic Corporation (NASDAQ: QUIK) is a publicly traded, US-owned, trusted supplier of FPGA and eFPGA cores with a proven 30+ year track record in delivering millions of units for commercial, ruggedized and mission critical applications. Five of the Top five and eight of the Top 10 DOD Primes use our technology today. Our Australis eFPGA IP generator leverages foundry standard cell libraries, enabling us to go from concept to tapeout of a customized FPGA/eFPGA for any process node in as little as days. In addition to our proprietary Aurora FPGA User Tools, we are also the first FPGA vendor that has shipped products with 100% open-source FPGA user tools, supporting RTL-to-bitstream for fully transparent and inspectable FPGA user tools. QuickLogic is a member of the DARPA Toolbox Initiative.
Trusted Semiconductor Solutions leverages the best commercial technology and manufacturing capabilities to create high-reliability integrated circuits for use in military/defense, space, avionics and industrial applications. As a SkyWater partner, these capabilities complement our offerings to bring you the most complete, trusted solutions in the market today.
Weebit Nano Ltd. is a leading developer of next-generation semiconductor memory technology. The company’s ground-breaking Resistive RAM addresses the growing need for significantly higher performance and lower power memory solutions in a range of new electronic products such as Internet of Things devices, smartphones, robotics, autonomous vehicles, 5G communications and artificial intelligence. Weebit’s ReRAM allows semiconductor memory elements to be significantly faster, less expensive, more reliable and more energy efficient than those using existing Flash memory solutions. Because it is based on fab-friendly materials, the technology can be quickly and easily integrated with existing flows and processes, without the need for special equipment or large investments.
SkyWater licenses Weebit’s ReRAM technology for a range of customer designs to enable higher performance and lower power memory solutions in IoT, automotive, AI and other applications.
AND provides discrete and integrated power products for the next generation of applications using our suite of novel semiconductor device, process and packaging technologies. We have developed tools and technologies for thin-crystalline semiconductor devices to offer breakthrough power MOSFETs. Based in Austin, Texas, our team has 70+ years of combined experience in the semiconductor industry. The company has been issued over 100 patents and has been named an IEEE Innovator of the Year.
We offer over 40 commercial products targeting numerous applications including data centers, automotive, electric motor drives, microinverters for renewable energy systems and many others in industrial and consumer markets. Our customers benefit from the esteemed industry veterans and distinguished professors who serve as our company advisors.
BRIDG is a non-for-profit entity and key partner for administering performance on USG-funded technology programs at the SkyWater Florida site (also known as the Center for Neovation). BRIDG provides an engagement channel at SkyWater’s Florida site for organizations that wish to interface with a nonprofit entity on advanced packaging technology programs. BRIDG is also focused on organizing an advanced packing National Manufacturing Institute that will be based out of the Center for Neovation to advance domestic development and low-volume prototyping of various back-end and advanced packaging technologies.
Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, Deca’s 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies in the first generation of M-Series™ fan-out and Adaptive Patterning®. As the industry moves to chiplets and heterogeneous integration, Deca’s Gen 2 technologies provide licensees with a powerful platform for future products. Deca’s vision is to empower customer innovation with advanced electronic interconnect technologies.
Recently, SkyWater signed a technology transfer and license agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology which enables state-of-the-art onshore advanced packaging foundry services.
The MIT community is driven by a shared purpose: to make a better world through education, research and innovation. We are fun and quirky, elite but not elitist, inventive and artistic, obsessed with numbers, and welcoming to talented people regardless of where they come from. Through teaching, research, and innovation, MIT’s exceptional community pursues its mission of service to the nation and the world.
SkyWater works with MIT on next-generation technology development for DARPA Electronics Resurgence initiative
Integra Technologies is a global leader in the sourcing, packaging, testing, and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle – from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high reliability applications.
Micross AIT offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight and power, or SWaP. Micross AIT houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems which include: