SkyWater Partners
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Meet the Partners who Streamline Your Solution

SkyWater partners with an accomplished group of semiconductor and process technology companies experienced in Design & IP, Packaging & Testing, and Process Development & Device Fabrication. These partnerships strengthen SkyWater’s Technology Foundry manufacturing ecosystem with complementary key capabilities, expertise, flexibility and quality for customers who value a forward thinking foundry partner.

Design and IP Partners

EDA Partner

Cadence

Design Partner

Trusted Semiconductor Solutions

Design Partner

Steifpower Technology

Design Partner

Intrinsix

Design Partner

Linear Microsystems

EDA Partner

Silvaco

EDA Partner

Cadence

Intelligent system design to accelerate design of the most complex electronics and intelligent systems. SkyWater’s PDK environment is based on a Cadence tool set which ensures:

  • Silicon design excellence
  • System innovation
  • Pervasive intelligence

Design Partner

Trusted Semiconductor Solutions

Trusted Semiconductor Solutions leverages the best commercial technology and manufacturing capabilities to create high-reliability integrated circuits for use in military/defense, space, avionics and industrial applications. As a SkyWater partner, these capabilities complement our offerings to bring you the most complete, trusted solutions in the market today.

Design Partner

Steifpower Technology

Steifpower Technology is a fabless power semiconductor provider dedicated to delivering innovative and cost-effective technologies that obtain the advanced power semiconductor solution. Unlike other semiconductor companies, Steifpower’s expertise has more than 30 years of power semiconductor experience in R&D and sales & marketing. We pursue the best in class performance in power device that create sustainable added values to the customers. 

Design Partner

Intrinsix

Intrinsix offers a 30 year history of creating semiconductors that work the first time. In the system. The company embraces and resolves complexity and tight schedules for customers at the leading edge. Fast growth companies that require an immediate deployment of teams who can span semiconductor design domains with practiced ease will benefit from the SkyWater – Intrinsix partnership.

Design Partner

Linear Microsystems

SkyWater’s partnership with Linear Microsystems, Inc. (LMI) ensures that your custom ASIC works correctly the first time.  LMI is a fabless semiconductor company that provides high performance RF, Analog and Mixed-Signal ASICs for a wide range of applications.  LMI is specifically designing custom ICs that target SkyWater’s commercial process nodes as well as the RH90 process, which supports radiation hardened and high temperature applications.  LMI’s world-class engineering staff is the foundation which makes the company a key partner for supplying high quality, high volume ASICs, including advanced SoC ASIC solutions. Linear Microsystems is one source for both development and production and also provides in-house wafer and package testing, coupled with superb in-house quality assurance.

EDA Partner

Silvaco

Silvaco, Inc. is a leading EDA provider of software tools used for process and device development and for analog/mixed-signal, power IC and memory design. The portfolio also includes tools for power integrity sign off, reduction of extracted netlist, variation analysis and production-proven intellectual property (IP) cores. Silvaco delivers a full TCAD-to-Signoff flow for vertical markets including: displays, power electronics, optical devices, radiation & soft error reliability, analog and HSIO design, library and memory design, advanced CMOS process and IP development. For more than 30 years, Silvaco has enabled its customers to bring superior products to market in the shortest time with reduced cost. Semiconductor fabs and design houses from around the globe have relied on Silvaco’s expertise to help develop the “technology behind the chip.” 

Process Development and Device Fabrication

Back-End Technology Services Partner

BRIDG

Foundry Services Partner

GLOBALFOUNDRIES

Back-End Technology Services Partner

BRIDG

BRIDG is a non-for-profit entity and key partner for administering performance on USG-funded technology programs at the SkyWater Florida site (also known as the Center for Neovation). BRIDG provides an engagement channel at SkyWater’s Florida site for organizations that wish to interface with a nonprofit entity on advanced packaging technology programs. BRIDG is also focused on organizing an advanced packing National Manufacturing Institute that will be based out of the Center for Neovation to advance domestic development and low-volume prototyping of various backed and advanced packaging technologies.

Website:https://gobridg.com/

Foundry Services Partner

GLOBALFOUNDRIES

GLOBALFOUNDRIES®, the world’s leading specialty foundry and a longtime supplier of microelectronics to the U.S. Department of Defense, and SkyWater Technology have signed a Memorandum of Understanding to manufacture secure solutions for the U.S. defense industrial base and cooperate on development of emerging technologies. The partnership will strengthen domestic supply and provide secure access to advanced technologies, while extending the availability and sustainability of Trusted semiconductor manufacturing in the U.S.

GF’s proven track record as a longtime supplier of secure semiconductor solutions for the defense industry dovetails with SkyWater’s focus on developing capabilities for enabling critical microelectronics technologies for national security applications. Notably, SkyWater is bringing to market a 90nm Strategic Rad-Hard process technology which, when combined with diverse GF platforms, will provide a richer portfolio of key defense technology offerings. The collaboration is also exploring possibilities for dual fab processing that would streamline access to secure technologies for defense programs. Additionally, as a part of the memorandum, GF and SkyWater will align technology roadmaps and leverage unique and complementary capabilities for development and high-volume production path to market for advanced computing, artificial intelligence and related technologies.

Packaging and Test Partners

Packaging & Test Partner

Micross

Packing and Test Partner

Integra Technologies

Packaging & Test Partner

Micross

Micross AIT offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight, and power (SWaP). Micross AIT houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems which include:

  • 3D integration technology: TSV, TGV, Si interposers, 3D IC
  • Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps, IIC Quilt Packaging™ interconnect fabrication
  • Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process
  • Novel microfabricated devices, including IR sensor and thin film thermoelectric solutions
  • Microstructure fabrication and packaging: Monolithic integration, vacuum microelectronics, wafer-level vacuum/hermetic packaging
  • Microfabrication facility offering development, custom (flexible) prototyping & small-volume production services for our customers

Packing and Test Partner

Integra Technologies

Integra Technologies is a global leader in the sourcing, packaging, testing, and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle – from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high reliability applications.  

  • Packaged Die test program development
  • Wafer Grinding, Dicing, and Package test of Die
  • Reliability qualification of Packaged Die
  • Thermal stress testing of Packaged Die
  • Wafer sort program development
  • Volume wafer sorting

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