Meet the Partners who Streamline Your Solution
SkyWater partners with an accomplished group of semiconductor and process technology companies experienced in Design & IP, Packaging & Testing, and Process Development & Device Fabrication. These partnerships strengthen SkyWater’s Technology Foundry manufacturing ecosystem with complementary key capabilities, expertise, flexibility and quality for customers who value a forward thinking foundry partner.
Design and IP Partners
Intelligent system design to accelerate design of the most complex electronics and intelligent systems. SkyWater’s PDK environment is based on a Cadence tool set which ensures:
- Silicon design excellence
- System innovation
- Pervasive intelligence
Trusted Semiconductor Solutions
Trusted Semiconductor Solutions leverages the best commercial technology and manufacturing capabilities to create high-reliability integrated circuits for use in military/defense, space, avionics and industrial applications. As a SkyWater partner, these capabilities complement our offerings to bring you the most complete, trusted solutions in the market today.
Steifpower Technology is a fabless power semiconductor provider dedicated to delivering innovative and cost-effective technologies that obtain the advanced power semiconductor solution. Unlike other semiconductor companies, Steifpower’s expertise has more than 30 years of power semiconductor experience in R&D and sales & marketing. We pursue the best in class performance in power device that create sustainable added values to the customers.
Intrinsix offers a 30 year history of creating semiconductors that work the first time. In the system. The company embraces and resolves complexity and tight schedules for customers at the leading edge. Fast growth companies that require an immediate deployment of teams who can span semiconductor design domains with practiced ease will benefit from the SkyWater – Intrinsix partnership.
SkyWater’s partnership with Linear Microsystems, Inc. (LMI) ensures that your custom ASIC works correctly the first time. LMI is a fabless semiconductor company that provides high performance RF, Analog and Mixed-Signal ASICs for a wide range of applications. LMI is specifically designing custom ICs that target SkyWater’s commercial process nodes as well as the RH90 process, which supports radiation hardened and high temperature applications. LMI’s world-class engineering staff is the foundation which makes the company a key partner for supplying high quality, high volume ASICs, including advanced SoC ASIC solutions. Linear Microsystems is one source for both development and production and also provides in-house wafer and package testing, coupled with superb in-house quality assurance.
Silvaco, Inc. is a leading EDA provider of software tools used for process and device development and for analog/mixed-signal, power IC and memory design. The portfolio also includes tools for power integrity sign off, reduction of extracted netlist, variation analysis and production-proven intellectual property (IP) cores. Silvaco delivers a full TCAD-to-Signoff flow for vertical markets including: displays, power electronics, optical devices, radiation & soft error reliability, analog and HSIO design, library and memory design, advanced CMOS process and IP development. For more than 30 years, Silvaco has enabled its customers to bring superior products to market in the shortest time with reduced cost. Semiconductor fabs and design houses from around the globe have relied on Silvaco’s expertise to help develop the “technology behind the chip.”
Process Development and Device Fabrication
BRIDG is a non-for-profit entity and key partner for administering performance on USG-funded technology programs at the SkyWater Florida site (also known as the Center for Neovation). BRIDG provides an engagement channel at SkyWater’s Florida site for organizations that wish to interface with a nonprofit entity on advanced packaging technology programs. BRIDG is also focused on organizing an advanced packing National Manufacturing Institute that will be based out of the Center for Neovation to advance domestic development and low-volume prototyping of various backed and advanced packaging technologies.
Packaging and Test Partners
Micross AIT offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight, and power (SWaP). Micross AIT houses an ITAR-registered microfabrication facility that allows us to provide development, custom (flexible) prototyping and production services for our customers. We provide a comprehensive array of advanced interconnect technologies for realizing your next-generation electronic systems which include:
- 3D integration technology: TSV, TGV, Si interposers, 3D IC
- Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps, IIC Quilt Packaging™ interconnect fabrication
- Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process
- Novel microfabricated devices, including IR sensor and thin film thermoelectric solutions
- Microstructure fabrication and packaging: Monolithic integration, vacuum microelectronics, wafer-level vacuum/hermetic packaging
- Microfabrication facility offering development, custom (flexible) prototyping & small-volume production services for our customers
Integra Technologies is a global leader in the sourcing, packaging, testing, and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability (“Hi-Rel”) applications where dependability and failure-free performance are of paramount importance. Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle – from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high reliability applications.
- Packaged Die test program development
- Wafer Grinding, Dicing, and Package test of Die
- Reliability qualification of Packaged Die
- Thermal stress testing of Packaged Die
- Wafer sort program development
- Volume wafer sorting