Bassel Haddad leads all aspects of SkyWater’s advanced packaging business including technology development, engineering, marketing and Florida fab operations. He is responsible for building and scaling the business serving both the defense and commercial market sectors. He is focused on strengthening collaborations with the advanced packaging ecosystem, including government partners, technology centers and university programs, while driving the growth trajectory of the business.
Before joining SkyWater, Haddad was with Intel since 2011, most recently serving as vice president and general manager of edge device and AI products in the network and edge group. In this role, he managed a multi-billion dollar P&L and leading innovations in edge AI and Internet of Things, or IoT. Earlier in his career, he held roles in platform architecture, silicon development, systems and software engineering, delivering leadership products to various end markets.
Haddad holds a Bachelor’s and Master’s degree in electrical engineering from Technion – Israel Institute of Technology. He is the primary inventor on five USPTO-issued patents in the areas of digital communication and systems architecture.