Advanced Packaging
As microchip architectures become more complex, advanced packaging is enabling new ways to integrate multiple devices, chiplets, and functions into compact, high-performance systems. SkyWater is building a domestic advanced packaging technology portfolio designed to support the future of 2.5D and 3D architectures.
Enabling New Architectures Through Advanced Integration
Advanced packaging is helping overcome the limitations of traditional scaling by bringing multiple devices together in highly integrated systems. SkyWater supports this shift with U.S.-based capabilities focused on interposers, wafer bonding, and fan-out wafer level packaging, enabling customers to pursue compact form factors, improved functionality, higher bandwidth, and greater power efficiency for critical applications.
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Silicon interposers
Bringing together high-density BEOL routing with through-silicon via electrical interconnects, SkyWater silicon interposers provide an advanced integration platform for combining multiple devices or chiplets in a highly compact form factor with power efficiency and improved functionality.
- All-copper TSVs (10um × 100um)
- Multi-layer routing at 1um line/spaceSupport for bridge interposer devices (without TSVs)
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Fan-out wafer level packaging
SkyWater and Deca Technologies are establishing the first high-volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.
- Integration of multiple dies in a package
- Deca Adaptive Patterning® Technology for high-yield routing
- Gen 2 technology will include finer line/space RDL and device I/O pitch capabilities
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Hybrid wafer bonding
Wafer-wafer bonding allows the direct interconnection of one device to another through extremely short interconnects, resulting in lower power consumption, higher bandwidth and extremely compact device size. SkyWater is partnering with Adeia (Xperi) to offer ZiBond® and DBI® wafer bonding technologies, enabling extremely high interconnect density capability.
- Fine pitch interconnect at low temperature
- Strong mechanical bonding for dissimilar CTE materialsDielectric bonding with Cu electrical interconnects
Advanced Packaging, Made in America
As demand grows for secure, resilient, and domestic microchip supply chains, SkyWater is investing in U.S.-based advanced packaging capabilities that help customers bring next-generation technologies closer to home. These capabilities complement SkyWater’s trusted foundry model and support the needs of customers building mission-critical and high-performance microelectronics.
Build the Next Generation of Microelectronics
As system complexity grows, advanced packaging is becoming a critical enabler of innovation. SkyWater combines domestic manufacturing, advanced integration capabilities, and collaborative expertise to help customers bring next-generation technologies to market.