Connecting Your Chips With the Right Solutions

Passive and active interposers drive advanced packaging solution performance to new levels.

Flexible Solutions to Make Your Chiplets Shine

  • Small to large format die sizes
  • 1- or 2-sided solutions
  • Integrated interconnect and passive components for multi-chip module integration
  • Various options for wafer level packaging, fan-out interconnect, Through Silicon Vias (TSVs), and Embedded Multi-die Interconnect Bridge (EMIB) configurations
  • Many more options supported

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Taking 2.5D to New Dimensions

  • Powerful and configurable solutions combining passive and active components
  • Interposer embedded RISC-V based mixed-signal chip functions
  • Solutions enable a vast array of functions including low-cost supervisory functions, encryption, root of trust verification, anti-tamper etc.

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More About SkyWater’s Services


Learn More About SkyWater Interposer Solutions