SkyWater’s transformation to the Technology as a Service (TaaS) model

March 13, 2021
By G. Dan Hutcheson

Excerpt below developed by Tom Sonderman, president and CEO, SkyWater Technology

TaaS departs from the foundry business model by integrating advanced packaging capabilities and shifting the classic foundry balance that’s heavy on contract manufacturing for wafers and light on service, towards a heavier weight on service. The key strategic goal is to make it easier for customers to cross the grand canyon between designing to a SOC chip on a wafer to designing to a System-In-a-Package via Heterogeneous Integration. One could argue this is just a renaming of a model that already exists. But the more you think about it the more you realize it’s a much better renaming. TaaS is more customer oriented than what some call ‘Heterogeneous Integration,’ which is an academic construction … while others call it ‘Disaggregated Design,’ which implies a perspective of completing a SOC design too expensive to put on a chip, necessitating a need to back up and tear it apart into chiplets to cut costs. Heterogeneous is ivy-tower hard to say and disaggregated implies initial failure, lost TTM, and then recovery. I think Tom’s got it right: TaaS is far easier to enunciate and takes the perspective of a first-time-right design approach where a SiP approach to architecture is considered from the start. Tom has also put SkyWater’s money where its mouth is with its new Florida facility: SkyWater for Domestic Advanced Packaging Capabilities.
Reprinted with VLSIresearch’s permission.

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