SkyWater Technology, technology realization partner and Deca Technologies, a provider of advanced electronic interconnect technology, has announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning within SkyWater’s advanced packaging facility in Florida. The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.
Read the article on SiliconSemiconductor.net: https://siliconsemiconductor.net/article/113708/SkyWater_Signs_Technology_Transfer_And_License_Agreement