We are offering two tours of the SkyWater Florida facility:

Monday, November 7, 3:30-5:00 p.m.
Thursday, November 10, 1:00 – 3:30 p.m.

Two people in a cleanroom wearing protective gear

Tour SkyWater’s Heterogeneous Integration Fab during RHET 2022!

The tour will start in the lobby of the fab where we will provide an overview of the work we’re doing at SkyWater Florida. We will then split the group. One group will go to the window tour on the second floor, and the other group will head downstairs to tour the sub fab. The groups will then switch. The total tour time will be approximately 1 hour and 15 minutes.

  • Registration for the SkyWater Florida tours is available on the RHET conference registration form.
  • Tour capacity is limited to 25 people each day.

We’re building the next generation of heterogenous integration technologies

200 mm semiconductor wafer

Silicon interposers

Bringing together high-density BEOL routing with through-silicon via electrical interconnects, SkyWater silicon interposers provide an advanced integration platform for combining multiple devices or chiplets in a highly compact form factor with power efficiency and improved functionality.

  • All-copper TSVs (10um × 100um)
  • Multi-layer routing at 1um line/space
  • Support for bridge interposer devices (without TSVs)

Fan-out wafer level packaging

SkyWater and Deca are establishing the first high-volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.

  • Integration of multiple dies in a package
  • Deca Adaptive Patterning® Technology for high-yield routing
  • Gen 2 technology will include finer line/space RDL and device I/O pitch capabilities
Read the Press Release
XBS200 Tool

Wafer bonding

Wafer-wafer bonding allows the direct interconnection of one device to another through extremely short interconnects, resulting in lower power consumption, higher bandwidth and extremely compact device size. SkyWater is partnering with Adeia (Xperi) to offer ZiBond® and DBI® wafer bonding technologies, enabling extremely high interconnect density capability.

  • Fine pitch interconnect at low temperature
  • Strong mechanical bonding for dissimilar CTE materials
  • Dielectric bonding with Cu electrical interconnects
Read the Press Release

We appreciate your interest in RHET 2022!

If you have any questions regarding RHET Registration or Wyndham Hotel Registration, please contact our meeting planner, Teresa Farris, at teresa.farris@archon-llc.com or call 719-964-3617.

Let’s make your next project a reality.

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