Connecting Your Chips With the Right Solutions
Passive and active interposers drive advanced packaging solution performance to new levels.
Flexible Solutions to Make Your Chiplets Shine
- Small to large format die sizes
- 1- or 2-sided solutions
- Integrated interconnect and passive components for multi-chip module integration
- Various options for wafer level packaging, fan-out interconnect, Through Silicon Vias (TSVs), and Embedded Multi-die Interconnect Bridge (EMIB) configurations
- Many more options supported
Taking 2.5D to New Dimensions
- Powerful and configurable solutions combining passive and active components
- Interposer embedded RISC-V based mixed-signal chip functions
- Solutions enable a vast array of functions including low-cost supervisory functions, encryption, root of trust verification, anti-tamper etc.