Skywater, Deca sign packaging pact

SkyWater Technology,  the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning in SkyWater’s packaging facility in Florida.

The companies are endeavoring to establish the first high volume FOWLP capability in the U.S. to bring proven solutions for single and multi-die packaging and advanced heterogeneous integration capability for chiplets through 2.5D and 3D implementations.

Deca’s Adaptive Patterning with mask-less laser direct imaging delivers high-density design rules and high production yields in a cost-effective miniaturized format.

Read the article in ElectronicsWeekly.com: https://www.electronicsweekly.com/news/business/skywater-deca-sign-packaging-pact-2021-10/?eea=*EEA*

 

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